RUGGEDIZED DIMMS
Designers of rugged platforms face a difficult decision
when planning their memory layout. Either they use
DRAM components directly soldered to the system board,
the most rugged but also expensive and inflexible solu-
tion, or they take standard SODIMMs and try to ruggedize
them by using straps or glue in order to fix them in their
socket.
Swissbit in cooperation with the SFF-SIG consortium
(Small Form Factor – Special Interest Group) has developed
a rugged module called XR-DIMM TM , the abbreviation XR
standing for eXtreme Rugged.
Using special mezzanine connectors and mounting holes
to attach the module to the system board creates a true
rugged system with the easy integration and flexibility
of DIMM solutions and the shock and vibration immunity
of memory down implementations.
The XR-DIMM closely follows the DDR3 72?bit SODIMM
standard and makes design in as easy as using a JEDEC
module, unburdening the system designer of memory
channel layout.
With multiple module densities the system integrator
can create different memory populations with one
system platform, avoiding multiple system board SKUs
and taking benefit in perfectly tested modules with a
just in time purchase option.
Memory down
SODIMM with fixture
XR-DIMM
DESIGN IN / LAYOUT
FLEXIBILITY OF MEMORY POPULATION
TESTABILITY AFTER SOLDERING
UPGRADE / REPAIR
REQUIRED BOARD SPACE
STACKABLE SOLUTION
PROTECTION AGAINST SHOCK
PROTECTION AGAINST VIBRATION
MEMORY COST
Difficult
Difficult
Medium
Difficult
Small to Medium
No
Good
Good
Low to Medium
Easy
Easy
Easy
Easy
Medium to Small
Yes
Medium (with glue?/?strap)
Bad
Low
Easy
Easy
Easy
Easy
Medium to Small
Yes
Good
Good
Medium
?
24
DRAM MODULES
相关PDF资料
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